Wafer Sorter
WDS300 Wafer Sorter
- Multiple Input/Output options available
(Wafer / Waffle Tray / Reel / Gel-Pak) - Support output wafer size 4” – 12”
(using adapter for 4”/6” wafer) - Chip AOI and Bin Grading during sorting
(optional item) - Air Sliding / Blower Ejector module for thin die
(Patent Pending) - Bond Head Over-Travel Protection
(soft touch down) - Modularized Collet Holder
(Quick change and Flatness Assurance) - High Flatness Work Stage with Auto Height Detection
| Items | Specification |
|---|---|
|
Machine Model |
Merak WDS300S (One loadport in & One loadport Out)
|
|
System Productivity
|
≥ 3000UPH (Dry Run Condition: Chip Size 5x5mm with Ejecting & Bonding time 300ms) |
|
System Capability |
±30㎛ / θ:±1˚ （Optional ±10um，±0.5° under condition of up-look camera) |
|
Material Handling Capability |
Die Size □ 0.5 ~ □ 20 mm (Option : ~ □60mm) Thickness 50 ~ 700㎛(Option:20~50㎛) |
|
System Capability |
Face Up Die Sorting & Bonding |
|
Input System |
1 wafer cassette compatibility 8“ / 12″ wafer (Waffle Pack & Tray in Ring adaptor available)
|
|
Output System |
1 wafer cassette compatibility 8“ / 12″ wafer (Waffle Pack & Tray in Ring adaptor available) |
|
Wafer System |
Wafer Handling 12” Wafer(Standard) 8” Wafer(Option) / Auto-Theta alignment 360˚ |
|
Bond Head |
Bond Force range 50 ~ 3000g |
|
Sorting Mode |
Wafer to Wafer, Wafer to Waffle Tray, Waffle Tray to Waffle Tray, Waffle Tray to Wafer, Reel to wafer, etc |
|
Options |
MPW，Auto Bond Head Change，Auto Pepper Pot Change, AOI etc |
|
Facilities Required |
Voltage AC380V ±10% , 3 phase/ Compressed air Over 5 Kgf/㎠ / Vacuum -750 mmHg below |
|
Dimensions & Weight |
W x D x H 2300mmX1700mmX2060mm (with Auto LD&UL) & 2,250Kg) |