Product: Process Materials and Supplies - myses

Process Materials

Solder ball

Solder paste

Solder ribbon

Tac agent

Diama flow

Back grind tape

Back grind tape

Dicing tape

DAF tape (Die attach film)

DAF tape (Die attach film)

Micro pin

TIM 1

FOUP, FOSB, Cassette

FOUP, FOSB, Cassette

Deflux

Flip chip underfill & Die attach adhesive

Flip chip underfill & Die attach adhesive

Jedec tray