Ball Attach and Recovery System
BA1700R Post Ball Mount Recovery System
- High Efficiency, can handle most defect types
(missing, shifted, oversized, undersized, extra, bridging) - Capable to handle small ball and narrow pitch
(Min ball size 60 µm, min ball pitch 100 µm) - Capable to handle ball / pillar
- 25MP camera with unique algorithm to locate and classify defects
- Special ball container for precise single ball supply
- Precision flux needle pressure control for secondary dispensing to ensure ball placement accuracy
- Can be used as integrated or standalone system
| Items | Specification |
|---|---|
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Substrate size/pallet size/product thickness
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Strip: 180×60～300(L) x 100(W) / Single 10×10～80x80mm （160×310） / Substrate or pallet thickness: 0.1～5mm
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Ball diameter and ball pitch |
0.06～0.89mm / 0.10～1.5mm
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Flux dispensing accuracy
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Positioning Accuracy：±10um / Flux dispensing accuracy ±15um
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Solder balls supply
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Air circular vibration – dispense one ball at a time
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Solder ball pick-up mechanism
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Ceramic pickup head / automatic optical ball alignment and positioning correction
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Solder ball placement accuracy
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±15 mm |
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Image processing system |
25MP high speed CCD / Resolution: 6-20 m / Field of view 32×48–100x100mm
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Inspection items
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Missing ball / Shifted Ball / Extra Ball / Ball Bridging / Oversize or Undersize Ball
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Flux dispensing and ball height measurement
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Automatic ball height measurement for every ball recovered
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Inspection and recovery rate
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Inspection time 0.5 sec per FOV / missing ball recovery < 3 sec/ball, remove and replace 5-8sec/ball (depend on defect type)
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Recovery Yield |
100% based on ball count (based on equipment capability)
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Machine dimension |
W x D x H 2500mmX1800mmX1650mm / Weight Approx 2,500kg
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Machine utility requirements
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Power 3 phase 380V ±10% / CDA 5 Kgf/㎠ / Vacuum: 750 mmHg / Power. 5.0KW
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