Ball Attach and Recovery System

BA1700 Ball/Pillar Mounter

  • High Productivity > 80K balls one time mounting
  • Mounting accuracy ± 25 µm with 25MP CCD
  • Able to handle substrate and single IC ball mount (single unit with edge distance < 0.1mm)
  • Warped substrate control by press head at vacuum stage (max warpage up to 15mm)
  • Fur Bin box with stable productivity without missing ball from template
  • Fast jig conversion time < 30 minutes
  • Integrable with inline Ball Recovery system
  • Capable to do Pillar Mount
Items Specification

Target BGA Substrate
a) Strip type capable size
b) Singulated type capable size

L x W, mm
150 x 60mm -> 300 x 100mm
□10mm — □80mm, Boat size (max) 160 x 310mm

Flux Printing Process
a) Fluxing Method
b) Positioning Accuracy


Pin Transfer
< ± 10 µm (mechanical accuracy)

Ball Mounting Process
a) Ball Mounting Method
b) Capable Ball Size / Pitch
c) Position Accuracy
d) Ball count per pick


Fur Bin Box + Inclined Template + Vacuum Pick & Place
Φ0.125 – φ0.76 mm / 0.22mm – 1.27mm
< ±10 μm (Mechanical Accuracy)
≥ 80,000

Cycle Time

15-18 [sec/1time] / Strip; 25-28 [sec/1time] / Single Unit
(200 – 240 strip/hour, 128 – 144 boat/hour)
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