Mounters

Auto Wafer Mounter

  • Fast conversion 8”/12” wafer < 10 minutes
    (One touch change design – mount chuck & Transfer pad)
  • High Productivity > 50 WPH
  • Multi Cassette Loading for Wafer Ring Frame
    (Std 2 cassette)
  • High Mount Accuracy Within ± 0.5˚
  • Attach Head Driven by Linear Motor
    (Achieve high speed / accuracy and less maintenance cost)
  • Rigid Body Structure
    (Casting frame, less vibration)
  • User friendly GUI, SMEMA, SECS/GEM, E84
    (for OHT / AGV handling automation)
Items Specification

System Productivity

50 Ring Per Hour – UPH Min 50. (depends on tape feature and material size)
Material Handling Capability

Loader: 2 Loader Port (AGV available for FOSB, Option DSC Cassette or Join Jar)
Unloader: 2 Cassette Slot
Tape type : Pre-cut & normal Tape
Wafer size: 8” / 12” (Min thickness 200 µm, Max warpage 5mm)
Conversion time < 10 minutes

System Capability

Mount accuracy : Within ± 0.5˚
Ring Frame quantity : 100 sheets (12inch ring frame standard)
Tape consumption : 100M (based on ø375), Cutting margin : 30mm
Conversion time: Within 10 minutes (Mount chuck, Lead frame gripper)

System Condition

Work environment : class 1,000 Temp : 25˚± 5˚ Humidity : 50 ± 20%
Material contacts product surface resistivity: mount table 106~109  sq.

Facilities Required

Voltage AC 380V ± 10%, 50Hz, 3 phase/ Compressed air Over 5 Kgf/㎠ / Vacuum -750 mmHg below Power Consumption Approx. 8KW
Exhaust 10,000L Min. ø 100A – PVC Flange

Dimensions & Weight

2300mm x 1600mm x 2800mm (without FFU) / Weight Approx 3,500kg

Safety

General protection : EMO button, Power switch
Enclosing during EQ operation (with gate door)

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