Bonders
TB1000 Thin Die Bonder
- High Productivity UPH up to 10K (optional 2 steps bonding)
- On the fly X,Y, θ placement position correction (XY ± 10 µm, θ ± 1.0°)
- Specialized thin die handling (Die thickness ≥ 20 µm)
- Minimum change over – one touch change design (Ejector module, attach head)
- Changeless heater block
- 360° wafer alignment and precision θ correction
- Intelligent image processing system (substrate PRS, wafer PRS, pre/post-bond inspection
- Air sliding ejector module (Patent pending)
- Less vibration by rigidity body structure (Casting frame)
- User friendly GUI Function / SECS/GEM / E84 (Real time report, inspection data, etc)
| Items | Specification |
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System Productivity |
Epoxy (B/T 0.08s) : Direct 10,000 UPH
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DAF (B/T 0.5s) : Direct 3,600 UPH (Normal Die) |
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DAF (B/T 1.0s) : 2-Step 3,000 UPH (Thin Die)
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System Capability
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Epoxy X,Y = ±20㎛, θ:±1.0˚ / DAF X,Y = ±10㎛, θ:±0.1˚(With Under vision)
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Material Handling Capability
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Die Size □ 0.5 ~ □ 20 mm (Option : ~ □25mm) Thickness 50 ~ 700㎛(Option:20~50㎛)
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Substrate size Length 100 ~ 300mm / Width 30 ~ 100mm Thickness 0.1 ~ 1.2mm
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Magazine size Length 110 ~ 310mm / Width 40 ~ 110mm / Height 100 ~ 160mm
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Wafer System
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Wafer Handling 12” Wafer(Standard) 8” Wafer(Option) / Auto-Theta alignment 360˚
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Bond Head
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Bond Force 25 ~ 150g ± 10% 150 ~ 3,000g ± 5%
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Substrate Feeding System
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Track Width 30 ~ 100mm
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Pattern Recognition System
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PR System 256 Grey levels / Resolution 2048 pixels x 2048 pixels / Position Accuracy ± ¼ pixel / Angular accuracy ± 0.1˚
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Facilities Required
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Voltage AC200~240V ±10% , Single phase/ Compressed air Over 5 Kgf/㎠ / Vacuum -750 mmHg below / Power Consumption Approx. 2.2Kw
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Dimensions & Weight
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W x D x H 2100mmX1450mmX1550mm (with LD&UL: 2,130(W) ) / Weight Approx 2,200kg
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