Bonders
MCB3000 Multi Chip Bonder
- Application for Power Module products (eg IGBT)
- Multiple feeding methods – Wafer, Tray, Preform Solder Ribbon, Tape & Reel, Vibrator Feeder, DBC Carrier
- High XY placement precision ±7 μm and high throughput > 5K
- Flexibility, Multi-size Chip Bonding Capability
- Auto Bond Head and Ejector Tooling Change (B/H up to 10 set, Ejector up to 3 set)
- Intelligent image processing system (substrate PRS, wafer PRS, pre/post-bond inspection)
- Bond Head Over-Travel Protection (with soft touch down)
- Modularized Collet Holder (Quick change and flatness assurance)
- High Flatness Work Stage with Auto Height Detection (20 µm)
- User friendly GUI, SMEMA, SECS/GEM, E84 (for OHT / AGV handling automation)
| Items | Specification |
|---|---|
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Chip or Component Size |
Standard 0 . 3 mm- 16 mm ( Optional f rom 0 . 1 x 0 . 1 mm— 80 x 80 mm)
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Min Chip Thickness ( Wafer input) |
> 40 μm ( Optional up to 20 μm with Air Sliding Kit) |
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Bonding Head & Accuracy
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1 Gantry module with 8 heads / X、Y±7 μm， θ≤ 0 . 05 °。
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UPH Throughput
|
> 5000 （ Dry Run depending on process ）
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Device Loading:
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Wafer / Jedec Tray / Waffle / T& R Feeder / Clip Reel / Bowlfeeder / Stacker
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Substrate Loading & Capable Size
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Pink Carrier / Panel / Wafer / Strip / Shellbox / Metal / Glass etc （ max 330 x 460 mm）
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Bonding Process
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Die Attach ( faceup) / Flip Chip Attach( facedown) ( Option) / Pre Sintering （ TCB）（ Option）
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Dispensing ( Optional)
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Air Jetting Type / AUG Type / Stamping Type
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Auto Tooling Change
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10 Sets Bonding Head Auto Change ( Option 18 Sets) / 3 Sets Die Ejector Auto Change
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Bonding Force
|
Standard 1 – 30 N （ Optional to 170 N）
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Machine Vision
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Top CCD Vision x 1 Set / Bottom CCD Vision x 1 Set / Laser Confocol x 1 Set ( Option)
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Substrate Transfer & Fix
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Auto Conveyor Transferring with Vacuum Stage ( Heating up to 150 °） and top WIP plate
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Other Function
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Bottom Side Alcohol Spray
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Protocal
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SMEMA / E 84 / SECS& GEM
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Machine Working Type
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Inline System / Stand Alone / Capable of connection to OHT, AGV, MGV etc
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System
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Industrial PC / Win 10
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System HMI
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English / Chinese / Japanese
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